On the lithography floor, linewidth control is won or lost in the post-exposure bake. Temperature drift of just a couple degrees, or non-uniformity across the wafer, and you’re staring at CD excursions and scrap. We built our PEB heaters to take that variability out of the equation. What matters under the hood We’re talking wafer-level temperature uniformity of ±0.1°C across the bake surface, and photoresist temperature precision that stays within the tight thermal budget your process demands. The design uses short-wave infrared elements for quick, clean energy transfer, so ramp rates are fast without overshoot. Built for Class 1–100 cleanrooms, the housing and internal fixtures are engineered to generate zero particles, keeping contamination counts down cycle after cycle. Reliability comes from a simplified thermal stack and a solid control loop, with units field-proven to run tens of thousands of cycles with minimal drift. Why this matters on the line In high-volume fabs, PEB repeatability is the line between steady yields and constant stoppages. These heaters deliver the thermal stability advanced nodes require, where even small temperature shifts move CDs and surface parametric failures. You end up with tighter distributions across the lot, less rework, and bake times you can count on. The payoff is predictable lithography performance, less scrap, and a daily schedule that stays stable. What you need to know up front The heater is a direct, equivalent replacement for international semiconductor equipment standards, but integration details still matter. Make sure your chamber geometry, mounting interface, and power supply match our footprint and electrical specs. Commissioning is short—just enough to tune the ramp profiles to your photoresist stack. Once dialed in, the unit behaves thermally like the original, without forcing you to rewrite your process recipe.